Key Advances in Void Reduction
New advances in the reflow soldering process includingvacuum technology and warpage mitigation systems
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Component Cracking
Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow.
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Intermetallic Growth on PCB
Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method), an intermetallic of ...Show Details
PCB Nonwetting
Printed Circuit Board Nonwetting is a condition whereby a surface has contacted molten solder but has had part or none of the solder adhere to it.
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