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Introduction to the Process of SMT Oven

Introduction to the Process of SMT Oven

 

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Reflow soldering oven is a very important device on the SMT production line. Its English is Reflow, which is used to re-melt the solder solder pre-printed onto the board pad to achieve surface soldering of the soldered end or pin and printed board. Soldering of mechanical and electrical connections between disks. Reflow soldering is the soldering of components to PCB boards, and reflow soldering is for surface mount devices. Reflow soldering oven relies on the action of hot gas flow on the solder joint. The colloidal flux reacts physically under a certain high temperature airflow to achieve SMD soldering. The reason why it is called "reflow soldering oven" is because the gas flows in the welder to generate high temperature to reach the soldering. purpose.
 
Reflow soldering oven is a surface-mounted board. The process is more complicated and can be divided into two types: single-sided mounting and double-sided mounting.
A, single-sided placement: pre-coated solder paste → patch (divided into manual placement and automatic machine placement) → reflow soldering → inspection and electrical testing.
B, double-sided mounting: A-side pre-coated solder paste → Patch (divided into manual placement and automatic machine placement) → Reflow soldering → B-face pre-coated solder paste → Patch (divided into manual placement and machine automatic Mounting) → Reflow soldering → Inspection and electrical testing.
The simplest process of reflow soldering oven is "screen printing solder paste--patch--reflow soldering oven, the core of which is the printing machine printing precision, the patch is determined by the machine's PPM, and the reflow soldering is to control the temperature rise and Maximum temperature and falling temperature curve
 

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文章From:http://www.etasmt.com/te_news_bulletin/2019-10-21/11362.chtml