How to Use Reflow Oven

 

Reflow oven are used in surface mount technology (SMT) manufacturing or semiconductor packaging processes. Typically, reflow oven are part of an electronics assembly line, including printers and placement machines. The printer prints the solder paste on the PCB, and the placement machine places the components on the printed solder paste.

 

Setting up a reflow soldering oven furnace

Setting up a reflow soldering oven requires knowledge of the solder paste used in the component. Does the slurry require a nitrogen (low oxygen) environment during heating? Reflow specifications, including peak temperature, time above liquidus (TAL), etc.? Once these process characteristics are known, process engineers can set up reflow ovens with the goal of achieving a certain reflow profile. The reflow oven recipe refers to the furnace temperature setting, including zone temperature, convection rate and gas flow rate. The reflow profile is the temperature that a circuit board "sees" during reflow. There are many factors to consider when developing a reflow process. How big is the circuit board? Are there very small components on the board that could be damaged by high convection? What is the maximum component temperature limit? Is there a problem with rapid temperature growth? What is the desired contour shape?

Features and characteristics of reflow ovens

Many reflow ovens have automatic recipe setting software that allows reflow soldering to create a starting recipe based on board characteristics and solder paste specifications. Reflow soldering is analyzed by using a thermal recorder or a trailing thermocouple wire. The reflow setpoint can be adjusted up / down based on the actual thermal curve and solder paste specifications and board / component temperature limits. Without automatic recipe setup, engineers can use the default reflow profile and adjust recipes to focus the process through analysis.

 

Contact us directly for more information about reflow soldering oven