Key Process of Convection Reflow Oven

 

Ⅰ Key parameters of reflow oven

1. The number, length and width of the temperature zone;

2. Symmetry of upper and lower heaters:

3. Uniformity of temperature distribution in the temperature zone:

4. Independence of temperature control in temperature range;

5. Protective welding function of inert gas;

6. Gradient control of the temperature drop in the cooling zone;

7. The maximum temperature of the reflow soldering heater;

8. Temperature control accuracy of reflow soldering heater;

 

ⅡKey process parameters of reflow soldering oven process

1. Soldering temperature curve: According to factors such as the number and thickness of the multilayer board of the PCB, the volume and density of the soldered components, the area and thickness of the copper layer on the PCB, etc., test the actual welding at the solder joint

Temperature to set the temperature curve.

2.Control the preheating time, reflow time and cooling time: according to the length of the heater, the trajectory of the reflow curve is controlled by controlling the speed of the conveyor belt.

And cooling zone air volume to control.

3. As far as possible, the reflow temperature curve overlaps with the reference temperature curve provided by the solder paste supplier.

4.When dealing with SMT reflow soldering on both sides, generally one side of small-quality components is soldered first.

When soldering, large-quality 8-quantity devices that have been soldered to the bottom should be protected to prevent large-quality devices from falling off due to secondary reflow.

5. When conducting through-hole reflow soldering, attention should be paid to the displacement of components caused by equipment and transmission system vibration.

❙ SMT Reflow Oven Video