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Reflow Soldering Oven Temperature Curve Setting Basis
Reflow Soldering Oven Temperature Curve Setting Basis
 
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Reflow Soldering Oven
1. Set according to the specific conditions of the equipment, such as the length of the heating zone, the material of the heating source, the structure of the reflow oven and the heat conduction method.
 
2. Set according to the temperature curve of the solder paste. Solder pastes with different metal contents have different temperature profiles. The reflow profile of specific products should be set according to the temperature profile provided by the solder paste supplier.
 
3. Set according to the size of the exhaust air volume. General reflow ovens have specific requirements for the exhaust air volume, but the actual exhaust air volume sometimes changes due to various reasons. When determining the temperature curve of a product, the exhaust air volume should be considered and measured regularly.
 
4. Determine the set temperature of each temperature zone according to the actual location of the temperature sensor. If the location of the temperature sensor is inside the heating element, the set temperature is about 30°C higher than the actual temperature.
 
5. Set according to the material, thickness, multi-layer board and size of the PCB board.
 
6. Set according to the density of surface mount board components, the size of components, and special components such as BGA and CSP.
 
The increase in the assembly density of electronic products and the reduction in the size of components and their pin spacing have made the soldering process of SMA more difficult, and the setting range of reflow soldering temperature curve parameters has become narrower, and soldering quality problems are extremely prone to occur. The correct design of the welding process, especially the accurate setting of the welding temperature curve, has become one of the key contents to ensure the quality of SMA assembly.

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文章From:http://www.etasmt.com/te_news_bulletin/2020-08-19/18761.chtml