Process and design-related causes:

• Non-coplanar leads on the component

• Excessive warpage of the PCB or substrate

• Poor wetting

• Insufficient amount of solder due to improper printing parameters

• Skips in the printed solder due to blocked stencil aperture

• Misaligned solder print

• Improper stencil thickness

• Inadequate stencil aperture size

• Excessive pad size

• Via in pad draining solder from interconnection

Reflow-related causes:

• Preheat too aggressive

• Peak reflow (liquidus) temperature not being attained

• Malfunctioning oven which is impeding attenuation of proper temperatures

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