I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technICal team in Asia, Europe, AmerICa, AfrICa, and Australia.

I.C.T provide SMT solutions at various stages according to the different needs of customers. I.C.T is not only a provider of SMT equipment and technology, but also is the customer's escort in the field of SMT and DIP.

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I. Objectives of the Study

For many years, the electronics industry has been utilizing forced convection reflow with excellent results as a method to rapidly and reproducibly process SMT products.

Convection eliminates the need for infrared panels and reduces thermal shock to the components from rapid heating or over heating conditions. Forced convection also permits fine-tuning temperature profiles to the specific board or assembly type while providing the benefit of process repeatability. The current oven design utilized by

Heller Industries, permits the programming of a multi-zone temperature profile that has been determined to be optimal for the manufacturing process. The temperature conditions in the heated zones can be specifically maintained regardless of the process

load ensuring consistent manufacturing yields.

This report examines the functionality and stability of the Heller Industries Reflow Oven products when processing a variety of process load conditions. To demonstrate the repeatability of the process conditions, specific tests were conducted to measure

the performance of the I.C.T Oven under several process loading conditions.

The experiments were designed to permit the evaluation of several operational parameters and are detailed in this report. The report covers:

1. Temperature uniformity across the heated zones of the oven.

2. Temperature delta between large and small components on a circuit board (∆T).

3. Sensitivity to normal and excessive process load conditions.

4. A measurement of the effect on temperature and power consumption in the reflow zone under heavy load conditions.

 

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