Email: etaSMT@foxmail.com

 

 

Separating and collecting flux for removal from the reflow oven has always been required for nitrogen processing. With the implementation of ISO 14000 regulations, many companies require a similar system for air reflow to prevent the release of volatiles into the atmosphere. An automatic flux-removal system also serves to preserve the oven’s internal cleanliness, minimizing production interruption for maintenance purposes. Some flux separation and collection systems can remove 95 percent of flux residues from the oven interior, with extended maintenance intervals of 30 to 90 days in highvolume operations. These systems employ a combination of internal cooling techniques, mechanically activated flux agitation, and increased surface area for flux residue and particulate capture. For inert reflow, closed-loop systems can pass the nitrogen through a separation module and return it to the cooling zone. The “cleaned” gas can be recirculated, reducing the cost of nitrogen usage. Some systems have provisions for the addition of a Hepa filter to comply with local EPA or ISO guidelines, minimizing the amount of particulates released into the building’s exhaust system and the environment.

 

 

Conclusion 

The long-term impact lead-free assembly and ISO 14000 certification will have on the electronics industry is as yet undefined. However, initial implementation stages are developing rapidly. Lead-free paste alternatives are available and some companies have incorporated them successfully in major production lines. While the installed base of modern forced-convection reflow systems is capable of handling many new lead-free solder pastes, the newest oven configurations enable manufacturers to optimize reflow for the entire range of pastes and profiles. In anticipation of manufacturers’ needs to adapt their installed bases, oven suppliers have made innovations such as flux separation systems and center board supports that are retrofittable for existing equipment. Through a combination of adaptation and expansion, today’s reflow systems can be prepared for lead-free reflow and ISO 14000 certification. Such systems are already in use by numerous major assembly companies and are available to all manufacturers. Any implementation program begins with gathering information from various sources, including both materials and equipment vendors, as well as industry sources such as the IPC Web site (www.ipc.org) and the ITRI Web site (www.lead-free.org). Armed with an understanding of the issues involved, a manufacturer can take the steps required to maintain a competitive position in the worldwide electronics marketplace.

 

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