Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
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The probability that air will be drawn into the oven against the current of escaping nitrogen.
Most circuit boards with moderate thermal mass such as cell phones, PC mother boards and peripherals can be profiled successfully without bottom side forced convection. Show Details
The Generation 4.1 flux management system
The Generation 4.1 flux management system has been developed for machines equipped to run with an inert atmosphere and is the latest evolution of I.C.T Industries’ succe...Show Details
Key Advances in Void Reduction
New advances in the reflow soldering process includingvacuum technology and warpage mitigation systems
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Component Cracking
Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow.
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