Principle of Reflow Oven

 

Reflow soldering oven is a very important device on the SMT production line. Its English is Reflow, which is used to re-melt the solder solder pre-printed onto the board pad to achieve surface soldering of the soldered end or pin and printed board. Soldering of mechanical and electrical connections between disks. Reflow soldering is the soldering of components to PCB boards, and reflow soldering oven is for surface mount devices. Reflow soldering relies on the action of hot gas flow on the solder joint. The colloidal flux reacts physically under a certain high temperature airflow to achieve SMD soldering. The reason why it is called "reflow soldering oven" is because the gas flows in the welder to generate high temperature to reach the soldering. purpose.

 

The Principle of reflow soldering oven is divided into several descriptions:

A. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate. At the same time, the flux in the solder paste wets the pad, the component terminals and the leads, and the solder paste softens, collapses, and covers the solder. The disk isolates the pads and component leads from oxygen.

B. When the PCB enters the insulation zone, the PCB and components are fully preheated to prevent the PCB from entering the soldering high temperature zone and damaging the PCB and components.

C. When the PCB enters the soldering zone, the temperature rises rapidly and the solder paste reaches a molten state. The liquid solder wets, diffuses, diffuses, or reflows the pads, component terminals, and leads of the PCB to form a solder joint.

D. The PCB enters the cooling zone, causing the solder joint to solidify and the welding is completed.

❙ Reflow Oven Video