Basic Requirements for Reflow Soldering Oven

High quality reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven no matter what soldering technology is used, it is necessary to ensure that the basic requirements of soldering are met to ensure good soldering results. High-quality reflow soldering oven should have the following five basic requirements. The reflow manufacturer ETA will analyze it in detail.

Reflow soldering oven characteristics

Basic requirements for reflow soldering ovne:

Proper heat

2. Good wetting;

3. Proper solder joint size and shape;

4. Controlled tin flow direction;

5. The soldering surface does not move during reflow soldering.

1. Appropriate heat. Appropriate heat means that for the reflow soldering materials, there must be enough thermal energy to melt them and form an intermetallic interface (IMC). Sufficient heat is also one of the basic conditions to provide wetting. On the other hand, the heat must be controlled to a certain extent to ensure that the materials (not just the solder ends) in contact with them are not thermally damaged, and that the formation of the IMC layer is not too thick.

2. Good wetting. In addition to being a symbol of better solderability, wetting is also an important condition for forming the final reflow solder joint shape. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill. These problems will affect the life of the reflow solder joints.

3. The proper size and shape of the solder joints. To have sufficient life of the reflow solder joints, it is necessary to ensure that the shape and size of the solder joints meet the requirements of the structure of the solder joints. Too small solder joints have insufficient mechanical strength and cannot withstand the stresses in use, even the internal stresses existing after welding cannot be sustained. Once fatigue or creep cracking begins to occur in use, the fracture speed is also faster. The bad shape of reflow solder joints will also cause the phenomenon of weight reduction and light weight reduction, shortening the life of solder joints.

4. Controlled tin flow direction, the controlled tin flow direction is also an important part of the reflow soldering process. Molten solder must flow in the desired direction to ensure controlled solder joint formation. The phenomenon of tin absorption in the reflow soldering process is the technical details related to the direction of tin flow control.

5. The soldering surface does not move during the reflow soldering process. If the welding end moves during the soldering process, it depends on the movement and time, which will not only affect the shape of the solder joint, but also cause false soldering and inner hole conditions. This will affect the quality life of the solder joint. Therefore, the entire product design and process must take care that the welding end remains stationary during the welding process.

In the reflow soldering process, in addition to the above general soldering conditions, there is a special point that the chemical components in the solder paste that have no effect after the printing process must be processed in a timely manner. This is especially true for the first side in double-sided soldering processes.

High quality reflow oven, reflow soldering, reflow soldering oven, SMT reflow ovenNo matter what soldering technology is used, it is necessary to ensure that the basic requirements of soldering are met to ensure good soldering results.

❙  Video for SMT Reflow Oven