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Vacuum Soldering Systems |
Vacuum Soldering Systems Voids will be reduced up to 99%, solder joints quality optimized Double sided PCBs Suitable for PCBs, DCB, stamping grid and carrier Setting Parameter: evacuation time; vacuum hold time; ventilation time; vacuum pressure Only one sealing surface of the vacuum chamber "Vacuum Plus" is a system for improving quality of solder joints. Voids are reduced in a vacuum chamber which significantly improves the quality of the soldered product. Vacuum Soldering Reduction of voids in the solder joint results in: Increased thermal conductivity Low component temperature Increased durability of components In high-frequency applications the width of impedance of the solder joint is optimized (narrow). The vote performance of the components is thereby simplified.
The solder of the component is melted, the component goes in the vacuum chamber via the inline conveyor system. Because of the vacuum application voids will be sucked out of the solder joint. Process parameter are adjustable: evacuation, holding and venting time as well as reached vacuum. Then the component goes into the cooling zone where the solder is solidified. SMT Reflow Oven, Nitrogen Reflow Oven, Dual Lane Reflow Oven, Vertical Reflow Oven, Vacuum SMT Reflow Oven, Lead free SMT Reflow Oven, Reflow Oven Manufacturer, LED Reflow Oven, China Reflow Oven, radiator soldering Machine, IR curing oven, UV curing oven, |
文章From:http://www.etasmt.com/te_news_bulletin/2021-08-31/23363.chtml |