860 Pressure Curing Oven 

A Pressure Curing Oven , or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

PCO pressurizes air into a rigid vessel and heats & cools with forced convection.

Heaters, heat exchangers and blowers are internal to the pressure vessel.

When the curing process is complete, the Pressure Curing Ovens automatically relieves its pressure to 1atm and cools.

Process Specification:

n Process time: Generally 120 min or User’s spec

n Operating temp: 60oC ~ 200oC

n Maximum temp: 220oC

n Operating pressure: 1 bar – 10 bar

n Capacity: 24 Magazines (typical)

n Cooling method: PCW (17oC – 23oC)

n Cooling water pressure: 25 – 40 psi

n Pressure Cure Applications:

ü Composite Forming for the printing industry

ü Die Attach Curing

ü Wafer Laminating

ü Thermal Compress Bonding

ü Underfill Curing

ü Via Filling

ü Film & Tape Bonding

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