PCB Oven-Are You Ready For Lead-free?

 

I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technICal team in Asia, Europe, AmerICa, AfrICa, and Australia.

I.C.T provide SMT solutions at various stages according to the different needs of customers. I.C.T is not only a provider of SMT equipment and technology, but also is the customer's escort in the field of SMT and DIP.

Welcome more people to discuss with us about SMT technologies and solutions, please contact us for more information:

Tel: +86 13670124230 (WhatsApp/Skype/WeChat)

Email: etaSMT@foxmail.com

 

 

Various international market trends drive electronics manufacturers and their materials and equipment suppliers to develop new assembly techniques to reduce the industry’s environmental impact. Two primary forces in this drive are the movements to lead-free assembly and ISO 14000 certification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.

In some cases, the mandates take the form of legislation, such as the European Community directives that will restrict the sale of lead-bearing electronic products in Europe after January 1, 2004. In Japan,a voluntary program of lead elimination has gathered momentum among major manufacturers, including Sony, Matsushita(Panasonic), Hitachi and Toshiba.

Concurrently, many of these same companies and other industry leaders are implementing international ISO 14000 certification programs that support more environmentally friendly manufacturing

techniques. In addition to eliminating the use of lead and halides, certified companies must minimize the quantity of effluents being released into the atmosphere.

In both cases, electronics manufacturers have turned to vendors to provide materials and equipment that meet the new “green” standards.

Solder Pastes 

In terms of materials, a number of new lead-free solder pastes are being released to the market; because none of them are exact drop-in replacements for tin/lead solder, all require some process adjustments.

The primary difference between most of the new formulations and traditional solder is a higher melting point. Instead of reaching liquidus at 183°C, as tin/lead solder does, the lead-free pastes melt at anywhere from 195° to 227°C, depending on the formulation.

 

Profiling

Higher melting points shrink the process window dramatically. Eutectic tin/lead solder has a melting point of 183°C with a full liquidus temperature of 205° to 215°C and a maximum printed circuit board (PCB) temperature of 230° to 240°C. A true process window of 15° to 35°C exists.

However, the melting point of the more popular lead-free formulations is in the range of 216° to 220°C, and the full liquidus temperature is 225° to 235°C.

 

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