I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers,  Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology,  for the world Customers provide SMT total solutions. There are successful cases of SMT technICal team in Asia, Europe, AmerICa, AfrICa, and Australia.

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Removing flux from oven emissions was required to ensure environmentally friendly operation. 

Capturing the flux in filters, as had been done previously, was not considered effective, since putting flux-laden filters into landfills would not provide a satisfactory solution. Additionally, the maintenance involved in filter replacement required more production downtime than Sony was willing to allow.

What was sought was a new concept in automatic flux elimination. Tight temperature control with a low DT was, of course, the primary requirement needed to manage the very limited process window and produce Sony’s new, lead-free reflow profile.

Since the thermal technology to accomplish this task did not exist at the time of the company’s search, it was necessary for the team to evaluate both current technology and each supplier’s potential to develop new, one-of-a-kind engineering concepts. Following the initial evaluation, four finalists were selected and a “bake-off” was conducted, using the same tests as in the initial evaluation, to determine each supplier’s current and potential capabilities.

 

The supplier that Kohda selected, Heller Industries of Florham Park, New Jersey, was chosen for several reasons: its existing reflow technology was highly innovative and incorporated numerous advanced engineering features. In addition, Heller personnel proved flexible to work with and were willing to enter into partnership with Sony to develop the breakthrough designs required to achieve Kohda’s goals for lead-free, environmentally friendly operation. From late 1998 through delivery of the first new oven in October 1999, engineers from the two companies worked closely together to develop, evaluate and refine a number of revolutionary new designs that led to the successful implementation of Sony’s lead-free, flux-free assembly process.

Among these new technologies were two proprietary systems: one for tight gas flow circulation management and another for filterless flux removal with a self-cleaning mode.

Other innovations included a high-temperature blower motor assembly, a shorter Center Board Support and a reduction in overall machine length. The high-temperature blower motor assembly features a ball bearing motor with a stainless steel shaft and heavy-duty steel impeller wheel. It functions in conjunction with the gas flow circulation management system to maintain the very low DT that ensures full liquidus of the paste at 235°C without reaching the board danger zone of 240°C. Additionally, the ability to manage gas flow circulation was the critical factor in achieving the challenging lead-free profile.

 

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