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Inline reflow soldering with vacuum EXOS 10/26 |
How to avoid Voids? Ersa EXOS 10/26!A challenge for SMD solder joints is voids reducing the solder joint quality. They may even lead to component failure. The void rate can be reduced by applying a vacuum as soon as the solder becomes liquid. By striving for pressure compensation, the voids migrate into the area of the negative pressure, thus leaving the solder joints.
Description:
With the EXOS 10/26, Ersa presents a convection reflow soldering system with 22 heating and four cooling zones as well as a vacuum chamber after the peak zone, with which the void rate can be reduced by 99%. This is achieved by relying on technologies proven thousands of times in HOTFLOW models, such as heating and cooling zones or the intuitive, award-winning interface.
Techn. data:
Dimensions
Conveyor systemProcess zoneHeating systemVacuum chamberElectrical dataExhaust
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文章From:http://www.etasmt.com/te_news_bulletin/2021-09-03/25361.chtml |