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The Application of the Pin-in-Paste Reflow Process |
The Pin-in-Paste (PIP) reflow process, also called through-hole (TH) reflow or pin-in-hole (PIH) reflow technology, has become more popular because it eliminates time-consuming processes, such as hand and traditional wave soldering, without losing the advantages that through hole components can offer.
The pin-in-paste reflow process is similar to the SMT reflow process in the following way: Printing solder paste around the through holes first, inserting component pins to relative PCB holes and then sending it to the reflow oven to cook. But, in reality, the pin-in-paste reflow process is not as simple as the regular SMT process. A process engineer needs to evaluate the TH components’ ability in the following way:
Finally, you should perform experiments as part of the evaluation process. Keywords: SMT Reflow Oven, Nitrogen Reflow Oven, Dual Lane Reflow Oven, Vertical Reflow Oven, Vacuum SMT Reflow Oven, Lead free SMT Reflow Oven, Reflow Oven Manufacturer, LED Reflow Oven, China Reflow Oven, radiator soldering Machine, IR curing oven, UV curing oven
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文章From:http://www.etasmt.com/te_news_industry/2021-08-31/23962.chtml |