The Best Reflow Oven Process
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After years of concentration on resolving productivity-related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world’s leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort. Among the most active companies in this movement is the Kohda Division of the electronics giant Sony.
Kohda manufactures the Vaio laptop computer as well as Sony’s camcorders, digital cameras and the PlayStation 2. The circuit boards for these products are assembled on a total of 62 lines, in three shifts that run seven days a week. In the first quarter of 2000 alone, a million PlayStations were produced on these lines, along with Kohda’s other products.
Demanding technology is involved in Sony’s assembly process. The double-sided boards are densely populated and range in size from the motherboard for the laptop computer down to the circuit board that powers the Sony camcorder, which contains 1500 components on a substrate approximately the size of a playing card. In the course of developing such products and becoming a leading force in the worldwide consumer electronics marketplace, Sony has developed a high level of awareness of consumer trends. Within the past few years, the trend to favor companies with “green” manufacturing policies has gained increasing importance. Green manufacturing operations follow environmentally friendly practices that minimize adverse impacts such as emissions or landfill contamination. The most widely recognized international standard for green manufacturing is ISO 14000. The guidelines for ISO compliance incorporate a broad range of measures, including lead-free assembly and flux-free emissions.
Achieving ISO 14000 certification thus became a major goal for Kohda and Sony as early as 1997, well in advance of initia- tives such as the voluntary decision of the Japanese Electronics Industries Association and the current draft directives of the European Union. In order to minimize environmental impacts and remove lead from the assembly process, Sony undertook a massive, multi-faceted research program. Among other activities, a new, lead-free solder paste and reflow profile were developed. The primary differences between the new process and a traditional process using lead-based solder are the higher melting point of the paste and the demanding thermal profile required to process it effectively.
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