I.C.T LV Series Vacuum Reflow Oven Machine
I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various
welding processes, LV Series Vacuum Reflow Oven is high-end reflow products committed to keeping up with market demand to enhance
customers competitiveness.Its new design concept fully meets the needs of increasingly diverse processes, And considering the future direction
of the industry, entirely suitable for communications, automotive electronics, home appliances, computers and other consumer electronic
1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be
more than 99.99%.
2.Vacuum system:PCB directly enters the vacuum unit from soldering area. Start the vacuum process to reduce the vacuum pressure to
100mbar-5mbar. The internal gas such as pores and cavities overflows from the molten solder joint, which can reduce the void rate to less
3.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The
effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ ambient
temperature to a temperature stabilization .
4.Monitoring Software:Windows interface, traditional and simplified Chinese and English online free switch, and operator password
management, easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault
self-diagnosis, process monitoring, automatic generate and save process control documents, substrate transport dynamic display.
From zero to 240 °C due to optimized heat transfer
Each product has its own requirements in the manufacturing process. Optimized heat transfer over the entire soldering process is the basis for
best possible results.
The LV-Series offers flexibly controllable preheating zones within which your PCB is preheated and prepared for the actual soldering process.
The individual zones can be controlled independently of each other via fan frequency, and assure best possible processes.
The LV-Series is equipped with special nozzle sheets for optimized heat transfer by means of uniform air flow over the PCBs. Flow speeds in the
upper and lower heat zones can be separately controlled, assuring that your PCB is heated up.
LV Series Vacuum Reflow Oven
|DIMENSIONS AND WEIGHTS|
|Weight||ca. 3200 kg||ca. 3300 kg|
|Load per unit area 400 kg/m2||400 kg/m2|
|PROCESS CHAMBER HEATING|
|Length of heating zones||3730mm|
|Quantity of preheating zones||7|
|Length of preheating zones||2675mm|
|Quantity of peak zones||3|
|Warm up time||ca. 20 min|
|Vacuum maximum pressure||0.1-12kpa|
|Vacuum pump flow||1500/min|
|Pressure relief time||≦10S|
|Quantity of cooling zones||3(top 3/bottom 3)|
|Length of cooling zones||1460mm|
|Transport Level||900 ±20 mm|
|PCB Width||L500 - W400mm|
|Conveyor control||3-stage, independent control|
|Adjustable conveyor speed||300 - 1800 mm/min|
|Voltage supply||5-Wire System 3P,N,PE 380 VAC ± 5 % 50 Hz Other voltages upon request|
|Operating capacity||16 KW|
|As the operating efficiency depends on the settings of the process parameters, the values reached actually can differ from the values indicated here.|