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SMT Oven New Process Elements

From: Author: Publish time:2021-09-02 11:43 Clicks:19

I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines including SMT Stencil Printers, Pick and place machines, Reflow Oven, AOI Machine, Wave Soldering Machine and PCB Handling Machine etc. I.C.T has more than 25 researches on SMT and DIP technology, for the world Customers provide SMT total solutions. There are successful cases of SMT technICal team in Asia, Europe, AmerICa, AfrICa, and Australia.

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Lead-based eutectic solder melts at 183°C and achieves full liquidus at 210°C, where effective intermetallic transfer and a good solder result occurs. This leaves a generous 30°C process window before the substrate and components are adversely affected, at a temperature of 240°C. Sony’s new lead-free paste, on the other hand, has a melt range of 216-200°C and reaches full liquidus at a range of 230-235°C — a mere 5°C below the maximum allowable temperature of 240°C. Maintaining such a small DT when processing any boards, and particularly laptop motherboards with Pentium BGA components, presents a significant reflow challenge. In addition, the paste requires a demanding thermal profile with a rapid ramp-up from the 160-180°C plateau to 235°C.

As these new process elements were being developed, it became apparent that Sony’s existing eight-year-old reflow ovens were no longer capable of satisfying either the rigorous demands of the lead-free profile or the environmental requirements of fluxfree emissions. These factors prompted Kohda to undertake a worldwide search, not only for advanced reflow equipment, but also for a supplier with the capability to develop technology that did not yet exist, in order to satisfy the company’s new requirements. Over the course of a year, a Kohda evaluation team visited numerous reflow oven manufacturers in Japan, Europe and the United States, spending several days at each location.

The same tests — a load test, a DT test to track temperature changes, a repeatability test and a test of the profile change over time — were performed on all ovens. These tests were used to establish a baseline for comparison and to determine the potential of each supplier to meet Kohda’s selection criteria. These criteria included tight temperature control with a very low DT, the ability to meet the challenge of the lead-free profile, flux-free and filter-free operation with minimal maintenance and, finally, as short a machine footprint as possible. There was a specific reason for each criterion: the short footprint, for example, was necessary to conserve floor space in Kohda’s heavily-utilized manufacturing facilities.

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From: Author: Publish time:2021-09-02 11:43 Clicks:19

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