The Difference Between SMT Line and DIP Line - Reflow Oven
From: Author:Reflow Oven Publish time:2019-06-26 20:15 Clicks:473
The Difference Between SMT Line and DIP Line - Reflow Oven
SMT is the surface mount technology (short for Surface Mount Technology) and is currently the most popular technology and process in the electronics assembly industry. It is a circuit mounting technology in which surface-mounted components are mounted on the surface of a circuit board or other substrate, and soldered by reflow soldering or dip soldering.
SMT equipment products cover (SMT line, SMT printer, SPI, pick and place machine, AOI, reflow oven, PCB handling equipment).
DIP/ THT, an abbreviation for Dual In-line Package, refers to a device packaged in a plug-in form with a pin count of typically no more than 100. The often mentioned "DIP soldering" or "DIP soldering" refers to soldering DIP packaged devices after SMT.
DIP equipment products cover (DIP insertion line, wave soldering machine, assembly line, belt line), test equipment, packaging equipment, etc. .
SMT placement are typically mounted on leadless or short lead surface mount components. Solder paste is printed on the board first, then mounted on a placement machine, and then soldered to the device. DIP solders are devices that are packaged in a straight-in form and are fixed by wave soldering or manual soldering.
DIP solders are devices that are packaged in a straight-in form and are fixed by wave soldering or manual soldering.
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